Don't forget the power consumption on them. Cerebras Second-Gen Wafer Scale Chip: 2.6 Trillion 7nm Transistors, 850,000 Cores, 15kW of Power - https://www.toms

Don't forget the power consumption on them. Cerebras Second-Gen Wafer Scale Chip: 2.6 Trillion 7nm Transistors, 850,000 Cores, 15kW of Power - https://www.tomshardware.com/news/cerebras-wafer-scale-engine-2-worlds-largest-chip-7nm-850000-cores https://www.tomshardware.com/news/cerebras-wafer-scale-engin... Trying to cool 15kW to 20kW of power is also rather impressive. https://www.cerebras.net/cs2virtualtour https://www.cerebras.net/cs2virtualtour - the engine block and cooling manifold > The challenge of extracting more than 20 kW of heat from the wafer was solved by having the wafer "float" on a cold plate. The wafer is allowed to expand and contract while remaining in contact with the polished front side of the cold plate, despite the different coefficients of thermal expansion of copper and silicon. The cold plate is much more than a a slab of metal: advanced computational fluid dynamics modelling was used to design a labyrinth of coolant channels capable of maintaining a precise, stable, thermal environment even as 850,000 Al-optimized cores swing into action. > The power density of the CS-2 is too high for direct air cooling, so liquid cooling is used instead. The internal manifold transfers heat between the CS-2 system's internal coolant and facilties water. Separating these two fluids ensure that the CS-2 system is not affected by changes in the quality of facilities water and that the very highest-quality coolant circulates through the cold plate. > The two pump modules plug into the upper four dry-break connectors. The lower two are for the air-cooling or water-cooling heat exchanger.