3 ms·
Theoretically yes, but it's harder to control the heat for the duration you need to do that. The flex substrate is pretty melty. I would try it with a shovel t
by myself248 4y ago
Theoretically yes, but it's harder to control the heat for the duration you need to do that. The flex substrate is pretty melty.
I would try it with a shovel tip and a whole lot of spares to get the technique down, but if I only had one shot, I think I'd go with the author's technique, one wire at a time. Perhaps with less gap between the ends, though.
- neuralRiot 4y agoI’ve done this many times and in smaller ribbons with narrower traces, this is a FPCB the substrate is kapton and it should whitstand soldering temps pretty well the trickiest ones are FFCs (the white ones)
- jgrahamc 4y agoThe gap was to make up for the amount of ribbon I'd damaged along the way. I didn't want to shorten it too much!