Afaik these LWCs are supposed to also be easier to implement in HW (=smaller die area/gate count), but I'm also wondering is the difference really meaningful es

Afaik these LWCs are supposed to also be easier to implement in HW (=smaller die area/gate count), but I'm also wondering is the difference really meaningful especially with current manufacturing tech? I imagine there are limits on die size reductions where the returns really start diminishing very quickly.