> thermals seem to be more or less a solved problem due to the characteristics of the Apple Silicon chips. I am actually at a loss for words. So I'll ask a que

> thermals seem to be more or less a solved problem due to the characteristics of the Apple Silicon chips. I am actually at a loss for words. So I'll ask a question instead. Do you really believe what you just said or do you have no clue how CPUs work and passive cooling works?