4 ms·
"3D" means that components are physically stacked more than one layer thick, right? Is there any public info about how heat dissipation is handled?
by britneybitch 4y ago
"3D" means that components are physically stacked more than one layer thick, right? Is there any public info about how heat dissipation is handled?
- adgjlsfhk1 4y agoYeah. They put cache on top of the cores. Heat dissipation is handled by lowering the TDP a little and the fact that the cache doesn't produce much heat.
- britneybitch 4y agoThat makes sense. I imagined cores stacked on top of cores for some reason. Stacking cache does seem simpler.
- dlivingston 4y agoI think primarily it refers to the cache being physically located above the CPU die, yes. It's worth noting that AMD also uses FinFET transistors, which are physically 3-D [0, 1] (compared to MOSFET transistors, which are planar / 2-D). [0]: https://en.wikipedia.org/wiki/Fin_field-effect_transistor https://en.wikipedia.org/wiki/Fin_field-effect_transistor [1]: https://www.amd.com/en/press-releases/amd-demonstrates-2016jan04 https://www.amd.com/en/press-releases/amd-demonstrates-2016j...
- Arrath 4y ago> Is there any public info about how heat dissipation is handled? By pulling the chips back to 120w, it looks like!