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Lam Research Acquires Semsysco to Advance Chip Packaging
- xrayarx 4y agoFrom the article: SEMSYSCO is a global provider of wet processing semiconductor equipment. With the addition of SEMSYSCO, Lam gains capabilities in advanced packaging, ideal for leading-edge logic chips and chiplet-based solutions for high-performance computing (HPC), artificial intelligence (AI) and other data-intensive applications.