FTA: "Intel also needs to build up a third-party intellectual property portfolio, design services, and a chip packaging and testing ecosystem with partners to m

FTA: "Intel also needs to build up a third-party intellectual property portfolio, design services, and a chip packaging and testing ecosystem with partners to make it easier for customers to use Intel's manufacturing process." ... "so far, there is no evidence to show any of these hurdles have been overcome," Shi said. Apparently it's in this domain that TSMC is king.