This is probably one of the biggest challenges ahead, likely more so than making hardware that still somehow scales despite Moore’s law slowing down and taperin

This is probably one of the biggest challenges ahead, likely more so than making hardware that still somehow scales despite Moore’s law slowing down and tapering out entirely. The increased scale of integration with advanced 3D packaging and chiplets is a nice way forward, but the heterogeneity of those solutions need innovation at the programming model as much as anything else: how do you make such a complex system accessible in a way that the programmer can actually use it efficiently? As much as I like semiengineering and their articles, they are very hardware and process technology focused and tend to miss the software side of things.