This is mixing apples & oranges: The new fabs aren't the latest & greatest tech (e.g. 2-5nm) but they're still going to be producing 25-40nm chips using 300mm

This is mixing apples & oranges: The new fabs aren't the latest & greatest tech (e.g. 2-5nm) but they're still going to be producing 25-40nm chips using 300mm wafers which is smaller than most automotive-using chips which are 40-90nm (with the majority still being 90nm). The real problem though is that 300mm wafer size: A 40nm chip that was made for 200mm wafers still needs to be redesigned for 300mm wafers. It seems like that wouldn't be necessary--you'd think it would just mean you could cram more chips into a bigger space--but it's not so simple. It's not as difficult as designing for a completely new process (e.g. 5nm) but it's still a non-trivial change.