>> Power semiconductors aren’t the most bleeding edge. SiC technology is a recent game changer leveling all market players to the same tech level. IGBTs are no

>> Power semiconductors aren’t the most bleeding edge. SiC technology is a recent game changer leveling all market players to the same tech level. IGBTs are not quite a commodity at highest specs, and power modules are yet another years-long development. Infineon has been building modules with high power density for decades and that experience will also carry over to SiC chips. Where I'm at we are building our own SiC "modules" from discrete components for now and these are much larger than Infineon power modules - but we are air cooled ;-) It seems like there should be a standard form factor for 3-phase power modules by now. That would make them easy to replace even if you have different specs.