5 ms·
Agreed, but we should note that the fundamental problem is not transistor density or quantum physics, but heat dissipation. Going 3D makes smaller process nodes
by natekupp 15y ago
Agreed, but we should note that the fundamental problem is not transistor density or quantum physics, but heat dissipation. Going 3D makes smaller process nodes less important, but efficiently removing heat from a die stack is a real challenge. Sandwich a 130W TDP processor die between two other similar die and the heat dissipated per cm^2 is tremendous.
- geogra4 15y agoIANAEE but is there some way to integrate peltier junctions into a 3D microchip design so that the heat all gets funneled out of the CPU in a regulated and controlled manner?
- natekupp 15y agoNot my area of expertise, but I believe most research today is on microfluidics, introducing microchannels into 3D interconnect layers alongside the TSVs to cool the device. For example, http://deepaksekar.weebly.com/uploads/1/9/8/6/1986457/3d_microchannel_cooling.pdf http://deepaksekar.weebly.com/uploads/1/9/8/6/1986457/3d_mic...