Well, sometimes, and more frequently now at really small process nodes, but mostly no. Most electronic failures are basically mechanical and thermal cycling wi

Well, sometimes, and more frequently now at really small process nodes, but mostly no. Most electronic failures are basically mechanical and thermal cycling will cause fatigue failures more than elevated temperatures will accelerate things like electromigration. Lots of people still use 1960s style handbook methods anyway because there's no plug-and-chug replacement. The groundbreaking work here was by Michael Pecht back in the early nineties: https://apps.dtic.mil/sti/pdfs/ADA275029.pdf https://apps.dtic.mil/sti/pdfs/ADA275029.pdf