Having a smooth board seems at odds with having a large surface area for heat transfer, doesn't it? And wouldn't laminar flow also have less movement near the

Having a smooth board seems at odds with having a large surface area for heat transfer, doesn't it? And wouldn't laminar flow also have less movement near the surface? For optimal cooling, would you actually want turbulence to mix the layers? Instead of mounting fans at different angles, add some vanes or even duct work to aim and accelerate the flow where it needs to transfer heat. But, given that boards do not have completely standardized layouts, it seems like you eventually need to assume a forest of independent heat sinks sticking up in the air. You lose the commodity market if everything has to be tailor made, like the integrated heat sink and heat pipe systems in laptops.