3 ms·
Hard to do the math here though because you don't know the failure statistics in advance. Kind of a multi-armed bandit problem of sorts.
by klysm 4y ago
Hard to do the math here though because you don't know the failure statistics in advance. Kind of a multi-armed bandit problem of sorts.
- magicalhippo 4y agoWouldn't the Arrhenius equation[1] be a good approximation? It's used in the industry[2] from what I know. Of course you'll need some data for calibrating the model, but if you got that? [1]: https://en.wikipedia.org/wiki/Arrhenius_equation https://en.wikipedia.org/wiki/Arrhenius_equation [2]: https://www.ti.com/lit/an/snva509a/snva509a.pdf https://www.ti.com/lit/an/snva509a/snva509a.pdf
- buescher 4y agoWell, sometimes, and more frequently now at really small process nodes, but mostly no. Most electronic failures are basically mechanical and thermal cycling will cause fatigue failures more than elevated temperatures will accelerate things like electromigration. Lots of people still use 1960s style handbook methods anyway because there's no plug-and-chug replacement. The groundbreaking work here was by Michael Pecht back in the early nineties: https://apps.dtic.mil/sti/pdfs/ADA275029.pdf https://apps.dtic.mil/sti/pdfs/ADA275029.pdf