4 ms·
You seem to be ignoring that all the punch through connectors on a board are currently on the side that air must pass over. Furthermore, I've never seen a case
by CoolGuySteve 4y ago
You seem to be ignoring that all the punch through connectors on a board are currently on the side that air must pass over.
Furthermore, I've never seen a case, either desktop or rackmount, that allows one to angle the fans at anything other than a 90 degree angle or parallel to the board.
None of this makes sense in terms of fluid dynamics.
- saltcured 4y agoHaving a smooth board seems at odds with having a large surface area for heat transfer, doesn't it? And wouldn't laminar flow also have less movement near the surface? For optimal cooling, would you actually want turbulence to mix the layers? Instead of mounting fans at different angles, add some vanes or even duct work to aim and accelerate the flow where it needs to transfer heat. But, given that boards do not have completely standardized layouts, it seems like you eventually need to assume a forest of independent heat sinks sticking up in the air. You lose the commodity market if everything has to be tailor made, like the integrated heat sink and heat pipe systems in laptops.