That's for sure. I 100% agree that increased temperature will statistically increase failure rate. I'm just thinking that, the most common mechanisms of thermal

That's for sure. I 100% agree that increased temperature will statistically increase failure rate. I'm just thinking that, the most common mechanisms of thermal failure in electronics are caused by repeated thermal cycling which cause fatigue and stress failures at interconnects (solder bumps, silicon bonding, etc). Data centers are designed to be operated in a relatively very constant temperature environment, so I would suspect that the failure rate may not be raised significantly.