It won't be a simple redesign to tilt boards "slightly" because manufacturing processes that are already honed in need to be completely retooled, with likely mo

It won't be a simple redesign to tilt boards "slightly" because manufacturing processes that are already honed in need to be completely retooled, with likely more complexity (man different length of standoffs per board?) And additionally, there are only a few key components of a motherboard that need cooling. Most of the passive components like the many many decoupling capacitors don't generate significant heat. The components that do require access to cool air are already fitted with finned heat sinks and even additional fans. They interact with air enough to where a slight tilt cannot make a meaningful difference. Basically just adding a small piece of aluminum to key areas will work better than angling the whole board