Nvidia didnt lie about TDP. Apple is famous in EE circles for running their gear as close to TjMax as possible to avoid turning up fans. 8600M had a design def

Nvidia didnt lie about TDP. Apple is famous in EE circles for running their gear as close to TjMax as possible to avoid turning up fans. 8600M had a design defect, bad composition of glue securing microbumps connecting die to package. Thermal cycling in high stress scenarios softened improperly selected underfill and broke microbumps connecting die to package. Repeated heating up can again soften the compound to release stresses and temporarily reconnect broken traces. It never fixes the main issue of broken chip. https://en-academic.com/dic.nsf/enwiki/2011837#Problems https://en-academic.com/dic.nsf/enwiki/2011837#Problems https://semiaccurate.com/2009/08/21/nvidia-finally-understands-bumpgate/ https://semiaccurate.com/2009/08/21/nvidia-finally-understan... >On July 2, 2009, the date being ironically a year after the notorious 8-K that publicly kicked off bumpgate, the company put up a job listing for a “DIRECTOR OF PACKAGE TECHNOLOGY”. https://notebooks.com/2008/10/10/apple-to-replace-faulty-nvidia-gpus-in-macbook-pros/ https://notebooks.com/2008/10/10/apple-to-replace-faulty-nvi... 2010 saw 820-2850 with N8 (330uF) Tantalum caps frying under the GPU. For 2011 Apple "wisely" switched to AMD and we got 820-2915 with fried AMD GPUs :) Apple is simply BAD at cooling.