IBM introduced copper interconnects in 1997; the designs before that date were aluminum. IBM is now doing the same thing with "gate-all-around" that will replac

IBM introduced copper interconnects in 1997; the designs before that date were aluminum. IBM is now doing the same thing with "gate-all-around" that will replace FinFET, which itself replaced planar. You can't take a tube radio and manufacture it with opamps without substantial design changes. Samsung is starting to use GAA right now, and TSMC will use it for the next process node. https://www.theregister.com/2021/05/06/ibm_2nm_semiconductor_chips https://www.theregister.com/2021/05/06/ibm_2nm_semiconductor... https://www.ibm.com/ibm/history/ibm100/us/en/icons/copperchip/ https://www.ibm.com/ibm/history/ibm100/us/en/icons/copperchi...