3 ms·
Power semiconductors in EP packages aren't flip chip, so the back of the die is glued to the main pad, and that's soldered to the PCB for SMD parts or mounted t
by formerly_proven 4y ago
Power semiconductors in EP packages aren't flip chip, so the back of the die is glued to the main pad, and that's soldered to the PCB for SMD parts or mounted to a heatsink.
Logic ICs are generally flip chip, so the back of the die points at the IHS / cooler.