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New heat spreading tech delivers 740% increase in circuit power density
- bradknowles 4y agoIt will be interesting to see if/when this conformal copper coating starts actually showing up in real devices in the field that get into the hands of actual real people. Any bets on how many years/decades it takes?
- Rury 4y agoI don't think it should take decades, as the technology to make it is already conventional commercial tech. That said, the stated 740% increase is in comparison to traditional heat sinks. A lot of devices today have already been sort of heading in the same direction, as many are already utilizing the chassis as a significant heat sink (phone's, tablets, thin laptops). While I'm sure any designs utilizing this method would still see an improvement, I have my doubts it'd be a 740% improvement in currently thin devices.