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Chip creep was the behavior for chips to walk out of their packages due to temperature cycling, percussive maintenance helped reseat things, sometimes enough to
by Damogran6 4y ago
Chip creep was the behavior for chips to walk out of their packages due to temperature cycling, percussive maintenance helped reseat things, sometimes enough to make them work again.
(The Apple III was a beneficiary
https://www.techjunkie.com/apple-iii-drop/ https://www.techjunkie.com/apple-iii-drop/ )
- QuercusMax 4y agoMy dad always talked about lifting the front edge of a component up 2 inches and then letting it drop - he called it the "2-inch test". He said that either it would reseat whatever was flaky, or make it super obvious that it needed to be reseated.