> moving from 200 mm to 300 mm requires a total redesign That might be typically true, but it is not always true! The product line I work for produces the same

> moving from 200 mm to 300 mm requires a total redesign That might be typically true, but it is not always true! The product line I work for produces the same IC simultaneously in both 200mm and 300mm fabs. Same mask set, identical device, no redesign. And we are moving more of our existing products into 300mm fab without redesign at all. Process is 65nm.