For higher power chips, we're running into limits of air cooling. You can only blow so much air and make heat sinks with enough surface area that are still abl

For higher power chips, we're running into limits of air cooling. You can only blow so much air and make heat sinks with enough surface area that are still able to fit into chassis. At some point, we'll have to change cooling mediums, use chip materials that can run at high temperatures, and or improve performance per watt.