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The other one big obstacle is chips are square while wafers are round.
by ip26 5y ago
The other one big obstacle is chips are square while wafers are round.
- paulmd 5y agoit depends on the exact shape of your mask of course, but typically losses around the edges are in the 2-3% range. It's not really possible to fix this either since wafers need to be round for various manufacturing processes (spinning the wafer for coating or washing stages) and round obviously isn't a dense packing of the mask itself. It just kinda is how it is, square mask and round wafer means you lose a bit off the edges, fact of life.
- ip26 5y agoThe interesting part is loss scales with the die size.