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> supports nvme drives Before that, I'd honestly like to see TPM 2.0 support baked in first. > has no Bluetooth or Wifi by default Alas, not the case here[1]

> supports nvme drives Before that, I'd honestly like to see TPM 2.0 support baked in first. > has no Bluetooth or Wifi by default Alas, not the case here[1]. Genuinely looks like they just stuffed a consumer RPi CM4 on a custom carrier board wrapped in metal, pushed through the easier boilerplate environmental checks like all their other SBCs, then put out a press release. Not sure how I feel about the interconnect choice; power via Omnetics proprietary (28 VDC input, but nothing assertive in datasheet on satisfying 704 requirements) and everything else via Glenair proprietary (with roughly half a quarter physical clearance between them) in what appears to be the equivalent of 38999 service class F finish (which won't survive 500-hr dynamic salt spray). I also do wonder if mechanical engineers would raise a nit at the countersunk retaining of enclosure top. The hardest thing to swallow here is having to pay an undisclosed MIL premium for what will fundamentally be constrained by its consumer RPi CM4 core. Even if Curtiss-Wright lifetime buys for a gratuitous 10-yr support posture, it's hard to imagine how liabilities like tin whiskers can be pragmatically avoided, or what that means in terms of MTBF post-fielding. This will probably fill someone's niche, but I agree that what's really missing is a robust RPi4 clone. [1] https://www.curtisswrightds.com/products/computing/systems/sff/duracor-pi.html https://www.curtisswrightds.com/products/computing/systems/s...

m-p-3 5y ago
> Before that, I'd honestly like to see TPM 2.0 support baked in first. Maybe they could keep the price down by having a TPM connector and add the pinout for it, or even reuse some of the GPIO pins for it?
wildzzz 5y ago
You can mitigate tin whiskers with a conformal coat application. It's not going to be as good as lead solder but it is an acceptable method when you have no other option. Another possibility is that these are modified CM4 boards where parts were removed and resoldered using lead solder. The Broadcom chip is really the most critical component as you cannot buy them off the shelf but everything else could be purchased new and installed onto a stripped board or a brand new one made using the CM4 design files using lead solder.
- metaphor 5y ago
  > You can mitigate tin whiskers with a conformal coat application. Precisely how effective do you think that'll be when your core packages are fine grid BGA? > Another possibility is that these are modified CM4 boards where parts were removed and resoldered using lead solder. This is the only long-term and standard solution I see, including package reballing. However, the fundamental problem with this approach is that the underlying PCB substrate is consumer grade that isn't designed for rework.
MrDOS 5y ago
> wrapped in metal Not even new metal: for good or bad, this “DuraCOR Pi” appears to be repurposing the chassis of the DuraNET 20-11 Ethernet switch: https://www.curtisswrightds.com/products/networking/switch-router-systems/duranet-20-11.html https://www.curtisswrightds.com/products/networking/switch-r....

m-p-3 5y ago

> Before that, I'd honestly like to see TPM 2.0 support baked in first. Maybe they could keep the price down by having a TPM connector and add the pinout for it, or even reuse some of the GPIO pins for it?

wildzzz 5y ago

You can mitigate tin whiskers with a conformal coat application. It's not going to be as good as lead solder but it is an acceptable method when you have no other option. Another possibility is that these are modified CM4 boards where parts were removed and resoldered using lead solder. The Broadcom chip is really the most critical component as you cannot buy them off the shelf but everything else could be purchased new and installed onto a stripped board or a brand new one made using the CM4 design files using lead solder.

metaphor 5y ago
> You can mitigate tin whiskers with a conformal coat application. Precisely how effective do you think that'll be when your core packages are fine grid BGA? > Another possibility is that these are modified CM4 boards where parts were removed and resoldered using lead solder. This is the only long-term and standard solution I see, including package reballing. However, the fundamental problem with this approach is that the underlying PCB substrate is consumer grade that isn't designed for rework.

MrDOS 5y ago

> wrapped in metal Not even new metal: for good or bad, this “DuraCOR Pi” appears to be repurposing the chassis of the DuraNET 20-11 Ethernet switch: https://www.curtisswrightds.com/products/networking/switch-router-systems/duranet-20-11.html https://www.curtisswrightds.com/products/networking/switch-r....