3 ms·
Inside the CPU package, between the actual chips and the integrated heat spreader. If I didn't explain it well: https://www.dvhardware.net/article70404.html htt
by sp332 5y ago
Inside the CPU package, between the actual chips and the integrated heat spreader. If I didn't explain it well: https://www.dvhardware.net/article70404.html https://www.dvhardware.net/article70404.html
- gotaquestion 5y agoOhhh.. Got it. Thanks! Wow, that IS a problem.
- raverbashing 5y agoYes and as the article says: > Intel has also long preached the perils of solder TIM, which can lead to shorter lifespans due to microcracks in the solder TIM that form during heat-induced expansion and contraction. It's not just about "cheaper solution". Yes, solder will be best for an overclock but that's not the primary objective here.