No one has a crystal ball, but here's the industry road map: https://irds.ieee.org/editions/2021 https://irds.ieee.org/editions/2021 (start with executive summa

No one has a crystal ball, but here's the industry road map: https://irds.ieee.org/editions/2021 https://irds.ieee.org/editions/2021 (start with executive summary). TL;DR: things get really murky after a notional 2.1nm generation. Past that we'll need a new generation of EUV sources, advancements in materials, etc, that AFAIK are still quite far from certain (but I am not an expert on this stuff by any means). I personally think we're headed to a stall for a while where innovation will focus mostly on larger packaging/aggregation structures. Chiplets and related are definitely here to stay. DRAM is moving in package. Startups are playing around with ideas like wafer scale multiprocessors or ssds. I think clever combinations of engineering at this level will keep us with momentum for a while.