The two dies and interconnect are all part of the same silicon. In the chiplets used by AMD and many others, they use separate CPU dies with literal wires betwe

The two dies and interconnect are all part of the same silicon. In the chiplets used by AMD and many others, they use separate CPU dies with literal wires between them. This replaced the wires with hard silicon. Disadvantage of this technique is yields will be worse because the individual component is bigger, and this is limited to combining exactly two chips because it's not a ring-bus design.