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"Apple’s innovative packaging architecture that interconnects the die of two M1 Max chips to create a system on a chip (SoC)" Did they get their terminology co
by fulafel 5y ago
"Apple’s innovative packaging architecture that interconnects the die of two M1 Max chips to create a system on a chip (SoC)"
Did they get their terminology confused? Later it says "By connecting two M1 Max die with our UltraFusion packaging architecture [...]" which also sounds like it's a MCM and not a SoC.