> putting multiple dies on a single package This part isn't new, or why this is significant. For example, AMD has been doing this since Zen 2 (Ryzen 2xxx), com

> putting multiple dies on a single package This part isn't new, or why this is significant. For example, AMD has been doing this since Zen 2 (Ryzen 2xxx), combining 14nm and 7nm components. On the other hand, the top chip designers and foundries working together and standardizing is potentially very significant, though I reserve judgement until actual products are produced on this new standard.