Missing from this article, and rather important in the current supply chain issues situation, is packaging (testing, dicing, packaging into the chip package e.g

Missing from this article, and rather important in the current supply chain issues situation, is packaging (testing, dicing, packaging into the chip package e.g. BGA, QFN, SOIC etc). Packaging is generally done at separate factories from the fabs. A vast proportion of packaging factories are in China, something to keep in mind in the context of "trade wars": https://www.marketresearchreports.com/blog/2019/04/24/top-10-osat-companies-world https://www.marketresearchreports.com/blog/2019/04/24/top-10...