Yes, but the actual release states that they plan to jointly develop this (3M and IBM), not that they even have this adhesive, let alone the tech to stack the c

Yes, but the actual release states that they plan to jointly develop this (3M and IBM), not that they even have this adhesive, let alone the tech to stack the chips and do the interconnects. Really, this is an announcement of the development of vapourware, it doesn't come much more tenous than that. IBM seems to be pretty desperate for the spotlight lately.