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Generally I agree. This one caught my eye because it addresses such a basic problem that it seems more realistic to expect this one to actually make it from the
by breadbox 15y ago
Generally I agree. This one caught my eye because it addresses such a basic problem that it seems more realistic to expect this one to actually make it from theory to practice.
- 0x12 15y agoYes, but the actual release states that they plan to jointly develop this (3M and IBM), not that they even have this adhesive, let alone the tech to stack the chips and do the interconnects. Really, this is an announcement of the development of vapourware, it doesn't come much more tenous than that. IBM seems to be pretty desperate for the spotlight lately.