3 ms·
- Cost. Double or more. - Would require a redesign. - Certain parts of the die cannot be shrunk: bond pads, esd protection, output drive transistors. - Certa
by mastax 5y ago
- Cost. Double or more.
- Would require a redesign.
- Certain parts of the die cannot be shrunk: bond pads, esd protection, output drive transistors.
- Certain parts of chips are designed for proprietary processes (eFLASH, analog)