3 ms·
It is already the way you do it for parts like QFN (at least the way I do it): if it works then all good! If it does not, then heat it up again. I heard BGA is
by antoinealb 5y ago
It is already the way you do it for parts like QFN (at least the way I do it): if it works then all good! If it does not, then heat it up again. I heard BGA is actually pretty simple as you cannot apply too much paste, but I don't have so experience with it.
- Teknoman117 5y agoI'm doing this as a test mostly. I bought some 0.8mm 121 pin lattice iCE40HX FPGAs ($5 a pop) to test with with. Few enough balls that you can do a 4 layer stackup without cheating (no traces in the power plane layers). I hand-placed some 0.4mm QFNs before (LVDS to TMDS converter IC) (admittedly, only a ~90% success rate) so this has to be at least twice as easy.
- aidenn0 5y ago"Easier than QFN" isn't a glowing recommendation but makes me hopeful. QFNs are the bane of my existence.
- Teknoman117 5y agoI should mention, when I did QFNs, I used solder paste, a stencil, and a hotplate. I don't think I could ever manage to hand solder one. Passives on the backside were done with solder paste, a stencil, and a hot air reflow station.
- antoinealb 5y agoDo you have a reference to a hotplate you like for QFN? I have been considering one because I just don't get good results with hot air, and a reflow oven seems like a bit too much for my use case.