One of the failure modes for chips as they move to smaller process nodes is electromigration. >Electromigration is the movement of atoms based on the flow of c

One of the failure modes for chips as they move to smaller process nodes is electromigration. >Electromigration is the movement of atoms based on the flow of current through a material. If the current density is high enough, the heat dissipated within the material will repeatedly break atoms from the structure and move them. This will create both ‘vacancies’ and ‘deposits’. The vacancies can grow and eventually break circuit connections resulting in open-circuits, while the deposits can grow and eventually close circuit connections resulting in short-circuit. Chips that get very hot are expected to be the first to show this sort of failure. >In Black’s equation, which is used to compute the mean time to failure of metal lines, the temperature of the conductor appears in the exponent https://www.synopsys.com/glossary/what-is-electromigration.html https://www.synopsys.com/glossary/what-is-electromigration.h...