> You're making the mistake of taking their process names at face value. You're missing where I said in the next paragraph you snipped off that TSMC has been a

> You're making the mistake of taking their process names at face value. You're missing where I said in the next paragraph you snipped off that TSMC has been ahead at the "node size name". > Samsung 3nm is less dense than TSMC's 5nm which has been shipping since 2020. They are more than 2 years behind, as they still haven't matched TSMC 5nm even when their new 3nm launches. For high performance logic, drive currents, leakage, switching power, metal resistance, etc can all be equally or more important than density.