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Wouldn't a principle advantage of an actual, innovative 3D chip be better component distribution? That is, on average all the parts will be much closer to each

• rbanffy 15y ago
  From the images, it appears inter-chip connections run over the external borders. This increases the distances signals have to travel and limits the width of the buses. I am not familiar with the technical limits of building vertical buses connecting the various chips glued together, but I assume 1000+ bit wide buses would not be impossible, so, although limited, the limits seem pretty high. Optical interconnects may also be possible in such confined devices. It will be interesting to watch. If real devices built with that technologies start showing in p and zSeries machines before 2015, we'll have some serious performance bump in high-end computers.