4 ms·
I don't understand why TEC hasn't been somehow used to make 3D chips workable by now, even just for specialized applications where size and weight are not major
by ThaddeusQuay2 15y ago
I don't understand why TEC hasn't been somehow used to make 3D chips workable by now, even just for specialized applications where size and weight are not major concerns.
"Thermoelectric cooling uses the Peltier effect to create a heat flux between the junction of two different types of materials. A Peltier cooler, heater, or thermoelectric heat pump is a solid-state active heat pump which transfers heat from one side of the device to the other side against the temperature gradient (from cold to hot), with consumption of electrical energy. Such an instrument is also called a Peltier device, Peltier heat pump, solid state refrigerator, or thermoelectric cooler (TEC). The Peltier device is a heat pump: when direct current runs through it, heat is moved from one side to the other. Therefore it can be used either for heating or for cooling (refrigeration), although in practice the main application is cooling. It can also be used as a temperature controller that either heats or cools."
http://en.wikipedia.org/wiki/Thermoelectric_cooling http://en.wikipedia.org/wiki/Thermoelectric_cooling
- wmf 15y agoPeltier cooling is very inefficient; water cooling (especially with microchannels, where you could use some layers of the chip for cooling) is more efficient.
- ThaddeusQuay2 15y agoYet we don't do that today, either. Do we? Also, water is not as easy to handle as electricity, and such a system seems to be more complex than a sandwich of computing layers and thermoelectric cooling layers. Additionally, the side where the heat finally comes out of the package, could be connected to a thermoelectric generator, thus converting some of that heat back to electricity, which could then be used to reduce the total amount of electrical input, thus raising the efficiency of the entire system.