I'm speculating wildly here, but I suspect a major benefit to going 3D like this will be improved chip layout -- no need to take a lengthy route around all the

I'm speculating wildly here, but I suspect a major benefit to going 3D like this will be improved chip layout -- no need to take a lengthy route around all the stuff in the middle just to get from the ALU to the L1 cache (for example), just go straight up. Of course the article doesn't mention if it's possible to make (and align) vias through this special glue, but I would really hope so.