4 ms·
Silicon supply and engineering resources are a major issue for HEDT platforms. Thread Threadripper uses a massive amount of high quality silicon, Epyc has much
by wronglebowski 5y ago
Silicon supply and engineering resources are a major issue for HEDT platforms.
Thread Threadripper uses a massive amount of high quality silicon, Epyc has much better margins.
Supporting HEDT is living hell for Intel/AMD. You're often using all kinds of consumer hardware with otherwise enterprise grade gear. Addressing every little PCIe device issue and catering to a very very small market has very little ROI.
- kllrnohj 5y agoNot really, that's not how Threadripper works thanks to the chiplet design. It's not necessarily "high quality silicon" since it has a higher TDP budget. But regardless remember that in this case the 5800X and 5950X are also competing with Epyc for that same 8c chiplet silicon. For something like Intel's HEDT then yes, you're absolutely correct. That involves HEDT-specific binning and it eats into Xeon-W profits very directly. But for Threadripper it's not nearly as clear cut. In fact it seems more like it's silicon that failed to validate for Epyc since it's half the IO die of Epyc (for the non-Pro Threadripper anyway). Otherwise you're talking about AMD just taking Ryzen-quality chiplets, putting more of them on a substrate, and selling them at a huge markup. Take the Threadripper 3970X as just a simple example here. It's 4x 8c zen2 chiplets that can hit a peak of 4.5ghz at 280W TDP. Meanwhile the Ryzen 3950x is a 2x 8c zen2 chiplet that hits a peak of 4.7ghz at 105W TDP. So 3970x is 2x the silicon of the 3950x, but lower quality silicon, and AMD charged more than 2x for the 3970X. That's the brilliance of chiplets and Threadripper. It's Ryzen-class chiplets with half of an Epyc IO die (the IO die being 12nm GloFlo means it's not really competing for high-end prices anyway). It's binning they're already doing for they're primary product lines, not a specialized HEDT-specific process.