4 ms·
Yeah, it's not something I'd attempt without a fume hood and someone who knows what they're doing. The pic of mine had a simple brazed metal 'lid', which I man
by shabble 15y ago
Yeah, it's not something I'd attempt without a fume hood and someone who knows what they're doing.
The pic of mine had a simple brazed metal 'lid', which I managed to separate by scraping out the solder with a scalpel, and then finally a hot-air gun to melt the rest and pop the top off.
I'm sure I've seen references to HF (Hydrofluoric acid) used in depackaging, but since it also etches silicon, I'd imagine you'd need to be pretty amazingly accurate with it.
- reemrevnivek 15y agoOrdinarily, you use (fuming) nitric acid. This dissolves the epoxy packaging, but leaves silicon and metal intact. You need the HF to etch the top layers of metal/silicon from the die. These layers are above the actual circuitry, and help increase security so that an attacker can't steal IP by using nitric acid and microprobes or UV light to modify the operation of the IC. Flylogic has a special technique by which they selectively etch areas of the metal layers, but not the circuitry below.