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Pentium-III autopsy
- deleted 15y ago[deleted]
- bajsejohannes 15y agoIf you like this, I recommend http://www.youtube.com/watch?v=Qk73ye2_g4o http://www.youtube.com/watch?v=Qk73ye2_g4o . It a little journey into the trench warfare of microprocessors. It's pretty in-depth, but you can get a lot from it even if you don't understand everything.
- shabble 15y agoInteresting stuff. The method of inverting the die and bonding it to the processor carrier is called Flip-Chip (https://secure.wikimedia.org/wikipedia/en/wiki/Flip_chip https://secure.wikimedia.org/wikipedia/en/wiki/Flip_chip), and replaced bonding wires for higher density and better thermal properties (you get direct access to the back of the silicon substrate) The electron microscope images are all cross-sectional, because it appears he doesn't have the equipment to do surface etching, and just cleaved the chip. I've not generally seen good sectional images around though, so it's definitely an interesting look. http://www.flylogic.net/blog/ http://www.flylogic.net/blog/ has a lot of stuff about depackaging and reverse-engineering chips, as does "Dr Decapitator" (http://decap.mameworld.info/ http://decap.mameworld.info/), who decaps old arcade ROMs, and then extracts their actual data from micrograph images to produce romfiles for emulators. Edit: The Sparkfun Saga of the Fake MCUs: Part 1: https://webcache.googleusercontent.com/search?q=cache:kMgE8BEttl0J:www.sparkfun.com/news/350 https://webcache.googleusercontent.com/search?q=cache:kMgE8B... Part 2: https://webcache.googleusercontent.com/search?q=cache:mEZ-8gGcwukJ:www.sparkfun.com/news/364 https://webcache.googleusercontent.com/search?q=cache:mEZ-8g... Part 3: https://webcache.googleusercontent.com/search?q=cache:3Tlcu2MhTp0J:www.sparkfun.com/news/384 https://webcache.googleusercontent.com/search?q=cache:3Tlcu2... (Links via google cache because they seem to have broken their old news URL structure) Edit^2: I forgot I had this old image of a System-in-Package radio module that I made myself (Digital camera through optical microscope at, iirc, 20x) http://metavore.org/faff/chip.jpg http://metavore.org/faff/chip.jpg The thick black lines at the bottom are millimetre markings on a ruler. The processor is at the centre, and the various other modules are SAW filters (https://secure.wikimedia.org/wikipedia/en/wiki/SAW_filter#SAW_filters https://secure.wikimedia.org/wikipedia/en/wiki/SAW_filter#SA...)
- soundsop 15y agoI am a circuit designer and SEM cross-sections are quite commonly used by transistor device designers during design and debug. They also appear in papers about transistor device design. A relevant conference is International Electron Devices Meeting and the related journal paper is IEEE Transactions on Electron Devices. Unfortunately, most of those papers are behind the IEEE paywall. Chipworks is a company that reverse engineers chips for analysis by competitors. Their websites has lots of cool SEM cross-sections: http://www.google.com/search?cx=w&q=chipworks+SEM&tbm=isch http://www.google.com/search?cx=w&q=chipworks+SEM&tb... Even though I design circuits using these devices, I still find the SEMs mindblowing.
- reemrevnivek 15y agoYou'll probably see this on the Sparkfun saga, but the way to remove it at the Atmega lab (with a hotplate and acetone) is quite dangerous. Don't try that at home. Instead, drop the whole chip in a test tube of fuming nitric acid at room temp, and let it work slowly overnight. Anything with fuming nitric acid is dangerous, but this is much safer than the hot plate method. See this tutorial by Travis Goodspeed: http://travisgoodspeed.blogspot.com/2009/06/cold-labless-hno3-decapping-procedure.html http://travisgoodspeed.blogspot.com/2009/06/cold-labless-hno...
- shabble 15y agoYeah, it's not something I'd attempt without a fume hood and someone who knows what they're doing. The pic of mine had a simple brazed metal 'lid', which I managed to separate by scraping out the solder with a scalpel, and then finally a hot-air gun to melt the rest and pop the top off. I'm sure I've seen references to HF (Hydrofluoric acid) used in depackaging, but since it also etches silicon, I'd imagine you'd need to be pretty amazingly accurate with it.
- reemrevnivek 15y agoOrdinarily, you use (fuming) nitric acid. This dissolves the epoxy packaging, but leaves silicon and metal intact. You need the HF to etch the top layers of metal/silicon from the die. These layers are above the actual circuitry, and help increase security so that an attacker can't steal IP by using nitric acid and microprobes or UV light to modify the operation of the IC. Flylogic has a special technique by which they selectively etch areas of the metal layers, but not the circuitry below.
- joelhaasnoot 15y agoI actually still have a P-III laying around here from an old PC that was being thrown, but the slot version with a massive heatsink. Just gathering dust, but a piece of history...
- pmarin 15y agoMy bittorrent machine is a P-III Coppermine at 667 Mhz. I found it in the middle of the street a year ago.
- ericd 15y agoIt's still a bit amazing to think back on that period, where you could get 50% gains in a year. I remember dropping a big chunk of my savings as a teenager to buy a 700 coppermine, 4 years later they were sitting on roads even if they still worked perfectly.
- geogra4 15y agoClock speed was king then. I'm sure everyone remembers when they stalled out ramping up the clock speed around 3.4-3.6GHZ and then it's pretty much been "back to the drawing board" ever since.
- psykotic 15y agoFun fact: The Pentium 4 was originally anticipated by Intel to eventually run at 10 GHz after a few years of process shrink. Seriously.
- cperciva 15y agoFun fact: If Intel wanted to, they could release a 10 GHz Pentium 4 design CPU. But it would be single-core and draw 500W, and require a many-thousands-of-dollars cooling system. Intel was quite correct in predicting that we would continue to get faster transistors, and the Pentium 4 was absolutely the right design to take advantage of faster transistors. The story of the past decade of CPU architecture is all about heat becoming a primary design problem for the first time in history.
- anshargal 15y agoIn Soviet Union this kind of autopsy (but at scale 10 to 1µm) was one of the options to reverse engineer US processors to make exact clones (other option was stealing design documents). DEC even put a message in Russian on one of its chips: http://micro.magnet.fsu.edu/creatures/pages/russians.html http://micro.magnet.fsu.edu/creatures/pages/russians.html
- sp332 15y agoReminds me of the breakdown of the Mifare Classic RFID cards, but on a much larger scale. They took cross-sectional images of the circuits, then used a Matlab script to turn the images back into simulated circuits. Then they performed cryptanalysis on it! Papers and video: http://events.ccc.de/congress/2007/Fahrplan/track/Hacking/2378.en.html http://events.ccc.de/congress/2007/Fahrplan/track/Hacking/23... The video is long but entertaining :) Edit: if the torrents aren't being seeded anymore, you can watch the video here http://www.podcast.tv/video-episodes/24c3-2378-mifare-2821896.html http://www.podcast.tv/video-episodes/24c3-2378-mifare-282189... or download from ftp://media.ccc.de/congress/24C3/matroska/24c3-2378-en-mifare_security.mkv
- shabble 15y agoFor an interesting look at the defense measures, see "Physical Security Devices for Computer Subsystems: A Survey of Attacks and Defences" http://www.atsec.com/downloads/pdf/phy_sec_dev.pdf http://www.atsec.com/downloads/pdf/phy_sec_dev.pdf IIRC there's a chapter on it in "Security Engineering" by Ross Anderson, too: https://www.cl.cam.ac.uk/~rja14/book.html https://www.cl.cam.ac.uk/~rja14/book.html (whole 1st edition is at the bottom of the page) Edit: The story of Chris Tarnovsky and his work in satellite TV smartcards is also a pretty good read - http://www.wired.com/politics/security/news/2008/05/tarnovsky?currentPage=all http://www.wired.com/politics/security/news/2008/05/tarnovsk...
- TechnoFou 15y agoI think that the best possible comment is: Simply Amazing!
- noelwelsh 15y agoKinda off-topic, but does anyone know how many registers the P-III and later have? I've read the P-II has 40, so I assume later chips have many more. Register allocation is one of the more expensive phases in a compiler, and register allocation on the Intel instruction set is particularly hard because it has some few registers. It's kinda ironic that internally modern chips have zillions of registers. There's a fat chunk of software that squeezes a program in 8 registers and then a fat chunk of silicon that expands into however many registers the chip has. Not only is this wasted effort, the extra silicon costs Intel in terms of power consumption and it one reason at ARM are pWning them on low power platforms.
- kijiki 15y agoThe P-III has 8 general purpose registers, just like all pre-64bit x86 CPUs, all the way back to the 8086. x86-64 (aka amd64) CPUs have 16. But it gets a bit more complicated. I'm talking about (and your references to compilers suggests that you are as well) architectural registers; the things assembly programmers and compiler writers see. The actual register file in the CPU has many more registers on out-of-order CPUs like the Pentium Pro and later; these are physical registers, and are mapped to the architectural registers dynamically by the register renamer. This is done to prevent false dependencies from preventing parallel execution of instructions in the same instruction stream. The work done by the compiler to map live variables into architectural registers is mostly orthogonal to the work the CPU's instruction scheduler does to map architectural registers to physical ones. In some sense, more architectural registers are better, but there are diminishing returns, and eventually other considerations make more worse. x86-64's 16 architectural registers is a pretty good compromise for current generation CPUs. Your comparison between ARM CPUs and x86 is somewhat spurious, since the instruction set defines the architectural registers: 16 for x86-64, 32 for ARM. A given out-of-order implementation can choose whatever number of physical registers gives optimal performance, and given the stakes and available engineering resources, both ARM and Intel/AMD will choose optimal (or exceptionally close to optimal) numbers for this. Long story short, the number of architectural registers is an extremely small part of why ARM is or isn't "pWning" Intel on low power platforms.
- Luyt 15y agoJeri Ellsworth makes NMOS transistors on silicon wafer chips at home, with an oven, rust remover and some other home chemicals: http://www.youtube.com/watch?v=w_znRopGtbE http://www.youtube.com/watch?v=w_znRopGtbE