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Yup, the trick though is you want some way to get all the pads balled to roughly the same height - otherwise when you heat it to solder it and the chip floats o
by Taniwha 5y ago
Yup, the trick though is you want some way to get all the pads balled to roughly the same height - otherwise when you heat it to solder it and the chip floats on the pads one or two may be too high to make contact ... or there's too much solder and it squeezes out and causes a hidden short.
The process of filling each hole in the stencil with the same amount of solder and carefully scraping any excess off of the top effectively adds the same amount to each ball
- csdvrx 5y ago> Yup, the trick though is you want some way to get all the pads balled to roughly the same height - I see you are familiar with the method :) Here's another "ghetto BGA reball" trick if that happens: lower the temperature of your iron to make the "pseudo balls" that are too big thinner by drawing some paste away into a vertical line extending up : let it cool down and just trim it to length with nail clippers. You can get balls again by rewarming a bit - ideally with a special IR heater to avoid pushing the balls away by the flow of air coming from a hot hairgun, but in a pinch a regular oven can do the job (prebake to temp of course)
- exikyut 5y agoIf you see this late reply - what sorts of IR heaters would I be looking for?
- aledalgrande 5y agothat reminds me of when I tried to soldier an extra chip on my PS1 and instead pulled up an original one oops