3 ms·
Think in 3D: I never said the Pogo should be under the chip in one 2d plane. They could be on the sides at an angle, and the chip in a "hole" cut in the PCB
by csdvrx 5y ago
Think in 3D: I never said the Pogo should be under the chip in one 2d plane.
They could be on the sides at an angle, and the chip in a "hole" cut in the PCB
- jacquesm 5y agoThat would probably not work, those chips have ground planes under them for cooling purposes.
- csdvrx 5y agoRAM remains passively cooled to this day, so some thermal pads diffusing the heat to the metal case might be enough
- joe_guy 5y agoI'm having difficulty picturing this. Can you point to an example? What's the reliability like on a socket like that to a decade of bumps?