The pad size for external wires might dominate the design for extremely simple designs, however couldn't a combination of these factors help? * Shrink the aver

The pad size for external wires might dominate the design for extremely simple designs, however couldn't a combination of these factors help? * Shrink the average node size 1-2 times (E.G. 180nm to 90 or 45nm) * Combine popular combinations of products into a single package that can have interlinks cut by laser or skipped at the metal traces stage? * Generally consolidate similar products within fewer variations? The slightly greater cost of the physical wafer is supposed to be offset by the increased machine throughput and the die shrinks possible, as well as ideally fewer defects by using newer processes. An extremely inexpensive set of processes for 300mm wafers would also be a good target for long term bulk semiconductor production.