No, that's pretty accurate. Though it could be argued that it was only the move to the smaller process node that necessitated a chiplet architecture (as a means

No, that's pretty accurate. Though it could be argued that it was only the move to the smaller process node that necessitated a chiplet architecture (as a means of spreading the thermal density, and to improve yield in a more hostile process). Also, Intel's tiling tech is more versatile than chiplets. Though AMD is adopting TSMC's SoIC, which should be comparable. https://www.hardwaretimes.com/intel-believes-its-tiles-are-a-better-approach-to-the-mcm-design-than-amds-chiplets/ https://www.hardwaretimes.com/intel-believes-its-tiles-are-a...