If it's not disturbed it could survive this, but ideally you can reduce the temperature just a bit further and increase the time period (though for some process

If it's not disturbed it could survive this, but ideally you can reduce the temperature just a bit further and increase the time period (though for some processes there is a temperature floor) so you don't liquefy the solder. If you just heat it and don't disturb the surface it should survive, but I'mma have to look up tin oxidation again. It might foam. Would be interesting to have media with a self-heating cycle.