4 ms·
Most high end chips with high TDPs are already packaged upside down. You CPU, or 9 out of 10 recent phone/tablet SoCs are all upside down chips. https://en.m.
by baybal2 5y ago
Most high end chips with high TDPs are already packaged upside down.
You CPU, or 9 out of 10 recent phone/tablet SoCs are all upside down chips.
https://en.m.wikipedia.org/wiki/Flip_chip https://en.m.wikipedia.org/wiki/Flip_chip
So, it's actually going to be an improvement from the thermals side, especially with TSVs carrying heat from the other side to the heatsink.
- hinkley 5y agoThe power layer is going to leak less power to heat than the other layers, correct? So the power rails will work as heat spreaders, if not particularly great ones.